Pan, Copper, 40 uL; 100/PK

Provides outstanding thermal analysis for a variety samples|Large volume crucibles offer increase the sensitivity|Low mass crucibles push the resolution to the limit|No reactions between sample and crucible caused by impure materials|Designed to guarantee high thermal conductivity and dimensional stability|Recommended for DSC,TGA/DSC or TGA measurements|Maximum temperature of 750 ?C|Ideally used for determination of oxidative stability (OIT) in presence of copper|These crucibles are designed for use in Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA) to ensure accurate thermal analysis by preventing direct contact between the sample and the sensor, avoiding sensor contamination. Available in various sizes and materials, they support a wide range of applications, including high-pressure tests, polymer melting, crystallization, and glass transition studies, helping you achieve optimal results in thermal measurements.